round type led lamps data sheet doc. no : qw0905- rev. : date : - 2006 30 - jun. a LSBI2643 LSBI2643 ligitek electronics co.,ltd. property of ligitek only pb lead-free parts
+ - page 1/5 LSBI2643 part no. ligitek electronics co.,ltd. property of ligitek only 2.9 3.1 package dimensions 0.5 typ 25.0min 1.5max 3.3 4.3 directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1.0min 2.54typ 75% 25% 75% 100%50% 25% 0 50%100% -60 -30 30 60 0
page 2/5 unit sbi ratings ligitek electronics co.,ltd. property of ligitek only ma mw ma a v 30 120 70 i f pd i fp 50 500 ir t opr esd -20 ~ +80 tstg -30 ~ +100 viewing angle 2 1/2 (deg) luminous intensity @20ma(mcd) 90 50 typ. min. dominant wave length dnm spectral halfwidth nm 3.8 65 465 typ. max. 4.7 forward voltage @20ma(v) parameter peak forward current duty 1/10@10khz forward current reverse current @5v electrostatic discharge( * ) power dissipation operating temperature storage temperature material blue ingan/sic emitted LSBI2643 part no color lens symbol absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) water clear 36 peak wave length pnm 430 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * LSBI2643 part no.
100 45 fig.5 forward current vs. ambient temperature fig.3 relative intensity vs. forward current 5 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve f o r w a r d c u r r e n t ( m a d c ) 10 0 0 20 30 ambient temperature ( ) 50 2575 r e l a t i v e i n t e n s i t y ( % ) 40 0 0 5 25 forward current (ma dc) 15 10 2035 30 40 50 25 75 125 100 20 f o r w a r d c u r r e n t ( m a d c ) 0 1 5 10 15 forward voltage(v) 2 3 4 30 25 sbi chip r e l a t i v e i n t e n s i t y lead temperature ( ) 0 025 50 75 100 fig.4 relative intensity vs. lead temperature 1 10 3/5 page r e l a t i v e i n t e n s i t y ( % ) 480 wavelength (nm) 380 0 430 0.5 630 530 580 680 fig.2 relative intensity vs. wavelength 1.0 ligitek electronics co.,ltd. property of ligitek only LSBI2643 part no.
page 4/5 ligitek electronics co.,ltd. property of ligitek only 150 time(sec) temp( c) 5 /sec max 260 c3sec max 100 260 120 50 25 0 0 preheat 60 seconds max 2 /sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) LSBI2643 part no.
5/5 page ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. operating life test test item high temperature storage test low temperature storage test reliability test: 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test thermal shock test 1.t.sol=230 5 2.dwell time=5 1sec solder resistance test solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition LSBI2643 part no.
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